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| TDA7265SA 18W+18W STEREO AMPLIFIER WITH MUTE & ST-BY 1 FEATURES WIDE SUPPLY VOLTAGE RANGE (UP TO +25V ABS MAX.) SPLIT SUPPLY HIGH OUTPUT POWER 18+18W @THD = 10%, RL= 8, VS = 17.5V NO POP AT TURN-ON/OFF MUTE (POP FREE) STAND-BY FEATURE (LOW Iq) SHORT CIRCUIT PROTECTION TO GND THERMAL OVERLOAD PROTECTION CLIPWATT 11 PACKAGE Figure 1. Package Clipwatt11 Table 1. Order Codes Part Number TDA7265SA Package Clipwatt11 2 DESCRIPTION plication as Hi-Fi music centers and stereo TV sets. The TDA7265SA is pin to pin compatible with TDA7269, TDA7269A, TDA7269SA, TDA7265, TDA7499, TDA7499SA. The TDA7265SA is class AB Dual Audio Power amplifier assembled in the @ Clipwatt 11 package, specially designed for high quality sound apFigure 2. Test and Application Diagram +VS 1000F MUTE/ ST-BY IN (L) 1F 3 15K 1F 5 7 + - 4 OUT (L) 18K 4.7 100nF 560 8 15K +5V P 18K GND 9 10 IN- (L) RL (L) IN- (R) 560 18K 1F IN (R) 11 + 1 6 -VS 1000F 2 OUT (R) 4.7 100nF RL (R) D94AU085 July 2004 Rev. 2 1/12 TDA7265SA Table 2. Absolute Maximum Ratings Symbol VS IO Ptot Tamb Tstg, Tj DC Supply Voltage Output Power Current (internally limited) Total Power Dissipation (Tamb = 70C) Ambient Operating Temperature (1) Storage and Junction Temperature Parameter Value 25 4.5 30 0 to 70 -40 to 150 Unit V A W C C Figure 3. Pin Connection (Top view) 11 10 9 8 7 6 5 4 3 2 1 IN+(1) IN-(1) GND IN-(2) IN+(2) -VS MUTE OUTPUT(2) +VS OUTPUT(1) -VS D03AU1506 Table 3. Thermal Data Symbol Rth j-case Rth j-amb Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Value max = 3 48 Unit C/W C/W Figure 4. Single Supply Application +VS C5 1000F MUTE PLAY 5V 0 MUTE Q1 BSX33 R2 15K C2 100F C3 1F IN (L) 5 7 + 8 9 C4 1F IN (R) 11 IN- (L) 3 4 OUT (L) R4 30K R5 1K + 2 IN- (R) R6 30K R7 1K C9 470F C6 0.1F D1 5.1V R1 10K C1 1F R3 15K R8 4.7 C7 0.1F C10 470F OUT (L) 10 1 6 GND OUT (R) R9 4.7 C8 0.1F OUT (R) D96AU444A 2/12 TDA7265SA Table 4. Electrical Characteristcs (Refer to the test circuit VS = 17.5V; RL = 8; RS = 50; GV = 30dB, f = 1KHz; Tamb = 25C, unless otherwise specified) Symbol VS Iq VOS Ib PO Parameter Supply Voltage Range Total Quiescent Current Input Offset Voltage Non Inverting Input Bias Current Output Power THD = 10%; RL = 8; VS = 13V; RL = 4; THD = 1%; RL = 8; VS = 13V; RL = 4; THD Total Harmonic Distortion RL = 8; PO = 1W; f = 1KHz; RL = 8; PO = 0.1 to 5W; f = 100Hz to 15KHz; RL = 4; PO = 1W; f = 1KHz; RL = 4; VS = 10V; PO = 0.1 to 5W; f = 100Hz to 15KHz; CT SR GOL eN Ri SVR Tj Cross Talk Slew Rate Open Loop Voltage Gain Total Output Noise Input Resistance Supply Voltage Rejection (each channel) Thermal Shut-down Junction Temperature Mute /Play threshold Mute Attenuation Stand-by Mute threshold Stand-by Attenuation Quiescent Current @ Stand-by -7 60 -3.5 f = 100Hz; VR = 0.5V A Curve f = 20Hz to 22KHz 15 f = 1KHz; f = 10KHz; 6.5 70 60 10 80 3 4 20 60 145 8 0.02 1 -20 500 18 18 13 13 0.03 0.7 Test Condition Min. 5 80 Typ. Max. 25 130 20 Unit V mA mV nA W W W W % % % % dB dB V/s dB V V K dB C MUTE FUNCTION [ref +VS] (*) VMUTE AMUTE VST-BY AST-BY IqST-BY -6 70 -2.5 110 3 6 -1.5 -5 V dB V dB mA STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply) (*) In mute condition the current drawn from Pin 5 must be 650A 3/12 TDA7265SA 3 MUTE STAND-BY FUNCTION The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS. - When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators are off. - When Vpin5 between = +VS -2.5V and VS -6V the final stage current generators are switched on and the amplifier is in mute mode. - When Vpin5 lower than = +VS -6V the amplifier is play mode. Figure 5. +VS (V) 20 t -VS -20 VIN (mV) Vpin5 (V) VS VS-2.5 VS-6 VS-10 Iq (mA) 0 VOUT (V) OFF STDBY MUTE PLAY STDBY PLAY OFF STDBY D94AU086 MUTE MUTE MUTE 4/12 TDA7265SA Figure 6. Test and Application Circuit (Stereo Configuration) +VS C4 C5 R2 C3 MUTE/ ST-BY IN (L) C1 +VS 5 7 + 8 3 R1 SW1 ST-BY DZ Q1 4 OUT (L) R5 IN- (L) R6 R7 C8 RL (L) R4 SW2 MUTE R3 GND 9 10 IN- (R) R8 R9 C2 IN (R) 11 + 1 6 -VS C7 2 OUT (R) R10 C9 RL (R) C6 D94AU087B 4 APPLICATION SUGGESTIONS (DEMO BOARD SCHEMATIC) The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer Table 5. . COMPONENT R1 R2 R3 R4 R5, R8 R6, R9 R7, R10 C1, C2 C3 C4, C6 C5, C7 C8, C9 Dz SUGGESTION VALUE 10K 15K 18K 15K 18K 560 4.7 1F 1F 1000F 0.1F 0.1F 5.1V Frequency Stability Input DC Decoupling St-By/Mute Time Constant Supply Voltage Bypass Supply Voltage Bypass Frequency Stability Mute Circuit Larger On/Off Time PURPOSE Mute Circuit Mute Circuit Mute Circuit Mute Circuit Closed Loop Gain Setting (*) LARGER THAN RECOMMENDED VALUE Increase of Dz Biasing Current Vpin #5 Shifted Downward Vpin #5 Shifted Upward Vpin #5 Shifted Upward Increase of Gain Decrease of Gain Danger of Oscillations Danger of Oscillations Higher Low Frequency Cutoff Smaller On/Off Time Danger of Oscillations Danger of Oscillations Vpin #5 Shifted Upward Vpin #5 Shifted Downward Vpin #5 Shifted Downward SMALLER THAN RECOMMENDED VALUE (*) Closed loop gain has to be 25dB 5/12 TDA7265SA 5 PC BOARD Figure 7. Evaluation Board Top Layer Layou Figure 8. Evaluation Board Bottom Layer Layout Figure 9. Component Layout 6/12 TDA7265SA Figure 10. Quiescent Current vs. Supply Voltage Figure 13. Output Power vs. Supply Voltage Figure 11. Frequency Response Figure 14. Quiescent Current vs. Pin #5 Voltage Figure 12. Output Power vs. Supply Voltage Figure 15. Attenuation vs. Pin #5 Voltage 7/12 TDA7265SA Figure 16. SVR vs. Frequency Figure 18. Power Dissipation vs. Output Power Figure 17. Attenuation vs. Pin #5 Voltage Figure 19. Power Dissipation vs. Output Power 6 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 17.5V, Rload = 8ohm, RTh j-c = 3 C/W , Tamb max = 50C 2V cc Pdmax = (N channels) * -------------------------- + I q V cc 2 R load 2 8/12 TDA7265SA Pdmax = 2 * ( 7.7 ) + 1.0 = 16 W 150 - T amb max (Heat Sinker) R Th c-a = ---------------------------------------- - R Th j-c = 150 - 50 - 3 = 3.25C/W --------------------16 P d max In figure 20 is shown the Power derating curve for the device. Figure 20. Power derating curve 35 30 25 (b) Pd (W) 20 15 (c) 10 5 0 0 40 80 Tamb (C) 120 160 (a) a) b) c) Infinite Heatsink 1.5 C/ W 3.0 C/ W 7 CLIPWATT ASSEMBLING SUGGESTIONS The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 21. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example, if a 15Kg force is applied by the clip on the package, the clip must have a contact area of 1mm2 at least. Figure 21. Example of right placement of the clip 9/12 TDA7265SA Figure 22. Clipwatt11 Mechanical Data & Package Dimensions mm DIM. MIN. A B C D E F F1 G G1 H1 H2 H3 L L1 L2 L3 M M1 10.7 19.85 17.9 14.55 11 5.5 2.54 2.54 11.2 0.421 1.57 16.87 1.7 17 12 18.6 0.781 0.700 0.580 0.433 0.217 0.100 0.100 0.441 0.49 0.77 0.8 0.15 1.5 0.55 0.88 0.15 1.83 17.13 0.062 0.664 0.067 0.669 0.480 0.732 0.019 0.030 0.031 TYP. MAX. 3.2 1.05 0.006 0.059 0.002 0.035 0.006 0.072 0.674 MIN. TYP. MAX. 0.126 0.041 Weight: 1.80gr inch OUTLINE AND MECHANICAL DATA Clipwatt11 0044448 G 10/12 TDA7265SA Table 6. Revision History Date September 2003 July 2004 Revision 1 2 First Issue Changing of the Style-sheet. Changed the maturity from Product Preview to Final. Description of Changes 11/12 TDA7265SA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 |
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